-Holes Array

This is an image of a micro-holes array with a scanning range of 30 μm after the Chemical Mechanical Polishing (CMP) process. The CMP process is a key technique for wafer flattening. It can provide a strong guarantee for the improvement of the CMP process in terms of surface roughness and surface shape measurement.

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CMP Micro-Holes Array
CMP Micro-Holes Array
  • SiC Surface
    SiC Surface
  • The Surface Potential of SRAM
    The Surface Potential of SRAM
  • Standard Wafer
    Standard Wafer
  • Microelectrode
    Microelectrode