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LTPS Grain -
a micro-holes array with a scanning range of 30 μm after the Chemical Mechanical Polishing (CMP) process. The CMP process is a key technique for wafer flattening. It can provide a strong guarantee for the improvement of the CMP process in terms of surface roughness and surface shape measurement.">
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68c0.199,0.77,0.229,1.567,0.113,2.338
C15.847,7.191,15.618,7.42,15.333,7.42z" />
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68c0.199,0.77,0.229,1.567,0.113,2.338
C15.847,7.191,15.618,7.42,15.333,7.42z" />