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    ge of a polished silicon wafer with a scanning range of 0.272 mm × 0.408 mm. The surface height variation across the entire scanned area ranges between -12 nm and 6 nm, with a roughness of 0.842 nm. Polished silicon wafers are fundamental and critical substrate materials in semiconductor manufacturing. Their surface quality directly affects subsequent photolithography, thin-film deposition and other processes.

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    Polished Silicon Wafer
    Polished Silicon Wafer
    The Edge Structure of PSS
    The Edge Structure of PSS
  • The Surface Potential of SRAM
    The Surface Potential of SRAM
  • Standard Wafer
    Standard Wafer
  • Tape Magnetic Domains
    Tape Magnetic Domains
  • LiNbO3 Ferroelectric Film
    LiNbO3 Ferroelectric Film
  • The Surface Potential of 2D Materials
    The Surface Potential of 2D Materials
  • Microelectrode
    Microelectrode
  • 2D Material's Magnetic Domains
    2D Material's Magnetic Domains
  • Polymer Particle
    Polymer Particle
  • Glass Substrate
    Glass Substrate
  • The Square-Shaped Pattern of the PZT Material
    The Square-Shaped Pattern of the PZT Material
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