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FreeSpirit (Shanghai) Precision Instrument Co., Ltd

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ize: 30 μm) after the Chemical Mechanical Polishing (CMP) process. As CMP is a critical process for wafer planarization, the precise measurement of surface roughness and topography provides reliable data support for CMP process optimization.

[AFM] CMP Micro-Hole Array

[AFM] CMP Micro-Hole Array