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    proximately 22 μm and its depth is approximately 15.2 μm. Obtaining the marking depth, groove topography and possible heat-affected zone bulging can be used to evaluate the marking quality and optimize laser process parameters.

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    Laser Marked Sample
    Laser Marked Sample
  • Lubricant Seal Cover
    Lubricant Seal Cover
  • Metal Groove
    Metal Groove
  • Polished Silicon Wafer
    Polished Silicon Wafer
  • Metal Scratch
    Metal Scratch
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