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LTPS Grain -
The Surface Potential of Au-Al Material -
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CMP Micro-Holes Array
This is an image of a micro-holes array with a scanning range of 30 μm after the Chemical Mechanical Polishing (CMP) process. The CMP process is a key technique for wafer flattening. It can provide a strong guarantee for the improvement of the CMP process in terms of surface roughness and surface shape measurement.
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CMP Micro-Holes Array -
-Holes ArrayThis is an image of a micro-holes array with a scanning range of 30 μm after the Chemical Mechanical Polishing (CMP) process. The CMP process is a key technique for wafer flattening. It can provide a strong guarantee for the improvement of the CMP process in terms of surface roughness and surface shape measurement.
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CMP Micro-Holes Array
OLED Pattern- Microelectrode
This is a microelectrode surface topography image with a scanning range of 28 μm, and its height is approximately 120 nm.
">Microelectrode -
182 nm Standard Step Height -
Girds Matrix -
Polished Silicon Wafer
-Holes Array
