Polished Silicon Wafer

This is a surface topography image of a polished silicon wafer with a scanning range of 0.272 mm × 0.408 mm. The surface height variation across the entire scanned area ranges between -12 nm and 6 nm, with a roughness of 0.842 nm. Polished silicon wafers are fundamental and critical substrate materials in semiconductor manufacturing. Their surface quality directly affects subsequent photolithography, thin-film deposition and other processes.

Polished Silicon Wafer