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LTPS Grain -
es; 0.685 mm. The laser drilling diameter is approximately 22 μm and its depth is approximately 15.2 μm. Obtaining the marking depth, groove topography and possible heat-affected zone bulging can be used to evaluate the marking quality and optimize laser process parameters.">
Laser Marked Sample
Lubricant Seal Cover
Metal Groove
Polished Silicon Wafer
Metal Scratch
es; 0.685 mm. The laser drilling diameter is approximately 22 μm and its depth is approximately 15.2 μm. Obtaining the marking depth, groove topography and possible heat-affected zone bulging can be used to evaluate the marking quality and optimize laser process parameters.">